GB/T 6060.1-2018
表面粗糙度比较样块 第1部分:铸造表面
Surface roughness comparison specimen—Part 1: Casting surface
- 实施日期
- 2019-04-01
- ICS 分类
- 17.040.20
组合使用关键词、标准类型、状态与 ICS 分类,快速定位所需国家标准。
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GB/T 6060.1-2018
Surface roughness comparison specimen—Part 1: Casting surface
GB/T 5677-2018
Castings—Radiographic testing
GB/T 5489-2018
Printed circuit board draw
GB/T 5274.1-2018
Gas analysis—Preparation of calibration gas mixtures—Part 1:Gravimetric method for class I mixtures
GB/T 5195.19-2018
Fluorspar—Determination of arsenic content—Silver diethyldithiocarbamate spectrometric method
GB/T 5195.18-2018
Fluorspar—Determination of barium sulfate content—Gravimetric method
GB/T 5195.17-2018
Fluorspar—Determination of flotation agents—Gravimetric method
GB/T 5169.26-2018
Fire hazard testing for electric and electronic products—Part 26: Smoke obscuration—Summary and relevance of test methods
GB/T 5169.25-2018
Fire hazard testing for electric and electronic products—Part 25: Smoke obscuration—General guidance
GB/T 5169.24-2018
Fire hazard testing for electric and electronic products—Part 24: Guidance for assessing the fire hazard—Insulating liquids
GB/T 5167-2018
Sintered metal materials and hardmetals—Determination of electrical resistivity
GB/T 4937.30-2018
Semiconductor devices—Mechanical and climatic test methods—Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
GB/T 4937.22-2018
Semiconductor devices—Mechanical and climatic test methods—Part 22: Bond strength
GB/T 4937.21-2018
Semiconductor devices—Mechanical and climatic test methods—Part 21: Solderability
GB/T 4937.20-2018
Semiconductor devices—Mechanical and climatic test methods—Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
GB/T 4937.201-2018
Semiconductor devices—Mechanical and climatic test methods—Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
GB/T 4937.19-2018
Semiconductor devices—Mechanical and climatic test methods—Part 19: Die shear strength
GB/T 4937.18-2018
Semiconductor devices—Mechanical and climatic test methods—Part 18: Ionizing radiation (total dose)
GB/T 4937.17-2018
Semiconductor devices—Mechanical and climatic test methods—Part 17: Neutron irradiation
GB/T 4937.15-2018
Semiconductor devices—Mechanical and climatic test methods—Part 15: Resistance to soldering temperature for through-hole mounted devices